![]() ![]() AIM water soluble paste residues are easily removed with DI water alone up to 48 hours after reflow, even under low stand-off devices. AIM has partnered with industry cleaner and chemistry manufacturers to ensure residue can be removed when necessary.ĪIM’s water soluble solder paste products have been engineered for powerful wetting and exceptional print performance even in high humidity environments. AIM’s full line of no clean solder paste is available in a wide selection of alloys to meet your process requirements. ![]() Designed to provide stable transfer efficiencies, powerful wetting, and low voiding, AIM no clean solder pastes address current and future assembly challenges. In addition to SAC based SMT paste, AIM offers low temperature solder paste and jetting solder paste.Ĭlick here to view the AIM Solder Paste Selection GuideĪIM’s no clean solder paste combines performance and reliability without the expense of cleaning. AIM’s alloy and flux combinations provide high quality performance for a wide variety of SMT applications. ĪIM solder paste is available in no clean, water soluble, and RMA formulations with a wide variety of alloy offerings including AIM’s proven REL alloys, SAC, SN100C® and lead-based solders. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for consumer, LED, automotive, aerospace and military applications. AIM's complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness.
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